EDITORIAL BOARD

Editor-in-Chief

Chi Kong (Michael) Tse, Hong Kong Polytechnic University, Hong Kong, cktse@ieee.org

Associate Editors

Soumitro Banerjee, Indian Institute of Technology Kharagpur, India, soumitro@ee.iitkgp.ernet.in

Mario di Bernardo, University of Naples Federico II, Italy, mario.dibernardo@unina.it

Lap-pui Chau, Nanyang Technological University, Singapore, elpchau@ntu.edu.sg

Andreas Demosthenous, University College London, UK, a.demosthenous@ee.ucl.ac.uk

Jiuchao Feng, South China University of Technology, China, fengjc@scut.edu.cn

Leonid Goldgeisser, Synopsys, USA, Leonid.Goldgeisser@synopsys.com

Mark Hooper, IEEE-CNSV: Consultants' Network of Silicon Valley, USA, m.hooper@ieee.org

Herbert Iu, University of Western Australia, Australia, herbert@ee.uwa.edu.au

Pedro Julián, Universidad Nacional del Sur, Argentina, pjulian@ieee.org

Alex Kot, Nanyang Technological University, Singapore, eackot@ntu.edu.sg

Xiang Li, Fudan University, China, lix@fudan.edu.cn

Elvis Mak, University of Macau, Macau, PIMak@umac.mo

Yoshifumi Nishio, University of Tokushima, Japan, nishio@ee.tokushima-u.ac.jp

Maciej Ogorzalek, AGH University of Science and Technology, Poland, maciej@agh.edu.pl

David Pan, University of Texas at Austin, USA, dpan@ece.utexas.edu

Michael Small, University of Western Australia, Australia, small@ieee.org

Yoko Uwata, University of Tokushima, Japan, uwate@ee.tokushima-u.ac.jp